DocumentCode :
1552068
Title :
SOI bipolar-MOS merged transistors for BiCMOS application
Author :
Zheng, Yue-Sheng ; Asano, T.
Author_Institution :
Center for Microelectron. Syst., Kyushu Inst. of Technol., Fukuoka, Japan
Volume :
35
Issue :
14
fYear :
1999
fDate :
7/8/1999 12:00:00 AM
Firstpage :
1203
Lastpage :
1204
Abstract :
A new MOSFET which has a built-in bipolar operation mechanism at the drain region has been fabricated using a bond-and-lap technique to form a silicon on insulator (SOI) structure. The results show that the merged transistors increase the transconductance by 15 times for a pMOS/npn transistor and by 60 times for an nMOS/pnp transistor as compared with conventional MOSFETs
Keywords :
BiCMOS logic circuits; integrated circuit measurement; integrated circuit technology; silicon-on-insulator; BiCMOS application; SOI; bipolar-MOS merged transistors; bond-and-lap technique; drain region; nMOS/pnp transistor; pMOS/npn transistor; transconductance;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19990812
Filename :
788970
Link To Document :
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