Title :
Interconnect layout optimization under higher order RLC model for MCM designs
Author :
Cong, Jason ; Koh, Cheng-Kok ; Madden, Patrick H.
Author_Institution :
Dept. of Comput. Sci., California Univ., Los Angeles, CA, USA
fDate :
12/1/2001 12:00:00 AM
Abstract :
In this paper, we study the interconnect layout optimization problem under a higher order resistance-inductance-capacitance model to optimize not only delay, but also waveform for interconnects with nonmonotone signal response in the context of multichip-module global routing. We propose a unified approach that considers topology optimization and waveform optimization simultaneously. Using a new incremental moment-computation algorithm, we interleave topology construction with moment computation to facilitate accurate delay calculation and evaluation of waveform quality. Our algorithm considers a large class of routing topologies, ranging from shortest path Steiner trees to bounded-radius Steiner trees and Steiner routings. We construct a set of required arrival-time Steiner (RATS) trees, providing smooth tradeoffs among signal delay, waveform, and routing area. When combined with the MINOTAUR MCM global router (Cong and Madden, 1998), (Madden, 1998) that we have developed, the RATS-tree solutions prove to be effective in reducing overall routing congestion
Keywords :
circuit optimisation; integrated circuit interconnections; integrated circuit layout; integrated circuit modelling; multichip modules; network routing; network topology; trees (mathematics); MCM design; MINOTAUR; delay optimization; global routing; higher order RLC model; incremental moment-computation algorithm; interconnect layout optimization; required arrival time Steiner tree; topology optimization; waveform optimization; Circuit topology; Context modeling; Design optimization; Integrated circuit interconnections; Propagation delay; Repeaters; Routing; Signal design; Steiner trees; Very large scale integration;
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on