DocumentCode :
1552442
Title :
Prepassivated AlGaN/GaN HEMTs with improved edge acuity in annealed ohmic contacts
Author :
Lee, Minhung ; Ryoo, Y. ; Lee, June-Goo ; Cha, Ho-Young ; Seo, Kazuyuki
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Seoul Nat. Univ., Seoul, South Korea
Volume :
47
Issue :
12
fYear :
2011
Firstpage :
725
Lastpage :
726
Abstract :
Sharp edge definition of annealed ohmic contacts is of great concern in AlGaN/GaN high electron mobility transistors (HEMTs) because it is strongly associated with breakdown voltage uniformity and reliability. In this reported work, two-step sequential annealing in conjunction with a low-damage SiNx dry etching technique was employed in a prepassivation process in order to improve the edge acuity in annealed ohmic contacts. As a result, uniformity in breakdown voltage was significantly improved in comparison with a conventional process.
Keywords :
III-V semiconductors; aluminium compounds; annealing; etching; gallium compounds; high electron mobility transistors; ohmic contacts; semiconductor device breakdown; semiconductor device reliability; wide band gap semiconductors; AlGaN-GaN; annealed ohmic contact; breakdown voltage reliability; breakdown voltage uniformity; edge acuity; high electron mobility transistor; low-damage dry etching technique; prepassivated HEMT; sharp edge; two-step sequential annealing;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el.2011.1190
Filename :
5873501
Link To Document :
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