DocumentCode
1552890
Title
Quality investigation of joint of bipolar transistor chip and lead frame by thermal wave method
Author
Suszynski, Z.
Author_Institution
Inst. of Electron., Tech. Univ., Koszalin, Poland
Volume
144
Issue
2
fYear
1997
fDate
4/1/1997 12:00:00 AM
Firstpage
78
Lastpage
80
Abstract
A nondestructive control method of bipolar transistor chip soldering to the lead frame based on the thermal wave method is described. The quality of the joint is determined from the phase characteristics of the chip´s thermal transmittance
Keywords
bipolar transistors; lead bonding; wave soldering; bipolar transistor chip; chip soldering; lead frame; nondestructive control method; phase characteristics; thermal transmittance; thermal wave method;
fLanguage
English
Journal_Title
Circuits, Devices and Systems, IEE Proceedings -
Publisher
iet
ISSN
1350-2409
Type
jour
DOI
10.1049/ip-cds:19970839
Filename
587456
Link To Document