Title :
Quality investigation of joint of bipolar transistor chip and lead frame by thermal wave method
Author_Institution :
Inst. of Electron., Tech. Univ., Koszalin, Poland
fDate :
4/1/1997 12:00:00 AM
Abstract :
A nondestructive control method of bipolar transistor chip soldering to the lead frame based on the thermal wave method is described. The quality of the joint is determined from the phase characteristics of the chip´s thermal transmittance
Keywords :
bipolar transistors; lead bonding; wave soldering; bipolar transistor chip; chip soldering; lead frame; nondestructive control method; phase characteristics; thermal transmittance; thermal wave method;
Journal_Title :
Circuits, Devices and Systems, IEE Proceedings -
DOI :
10.1049/ip-cds:19970839
