DocumentCode :
1553192
Title :
Modeling and Understanding of External Latchup in CMOS Technologies—Part II: Minority Carrier Collection Efficiency
Author :
Farbiz, Farzan ; Rosenbaum, Elyse
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Volume :
11
Issue :
3
fYear :
2011
Firstpage :
426
Lastpage :
432
Abstract :
The n-wells of the parasitic p-n-p-n devices found in a CMOS layout will collect excess minority carriers from the chip substrate, potentially triggering latchup. This paper presents a model for the minority carrier collection efficiency of a given substrate current injector and collector pair; the model captures the effects of spacing, supply voltage, temperature, and current level. The model further describes the quantitative reduction in collection efficiency obtained by using guard rings. A good fit of the model to measurement results is observed in four different CMOS technologies.
Keywords :
CMOS integrated circuits; MOSFET; integrated circuit layout; minority carriers; semiconductor device models; CMOS layout; chip substrate; current level effect; external latchup modeling; guard rings; minority carrier collection efficiency; n-well device; parasitic p-n-p-n device; spacing effect; substrate current injector; supply voltage effect; temperature effect; CMOS integrated circuits; Current measurement; Integrated circuit modeling; Mathematical model; Semiconductor device modeling; Substrates; Temperature measurement; CMOS; collection efficiency; latchup; substrate current;
fLanguage :
English
Journal_Title :
Device and Materials Reliability, IEEE Transactions on
Publisher :
ieee
ISSN :
1530-4388
Type :
jour
DOI :
10.1109/TDMR.2011.2159505
Filename :
5875873
Link To Document :
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