An Inside Body Power and Bidirectional Data Transfer IC Module Pair

Author

Lee, Edward K F

Author_Institution

Alfred Mann Found., Santa Clarita, CA, USA

Volume

46

Issue

8

fYear

2011

Firstpage

1820

Lastpage

1831

Abstract

An IC module pair utilizing only three wires was designed for biomedical implants with a master unit (MU) and a small, lightweight satellite unit (SU). Power was delivered from the MU to the SU using a three-phase signal and converted to dc in the SU IC module by a passive MOS ac-dc converter. Bidirectional data transfer between the two units was achieved by modulating the amplitudes (at periods that do not affect power delivery) and the positions of the rising and falling edges of the three-phase signal. A bidirectional data rate in the range of MB/s and an overall power efficiency of 90.2% for a 2.84-mW load were achieved in a 0.18-μm CMOS process.

Keywords

AC-DC power convertors; CMOS integrated circuits; bioelectric phenomena; prosthetic power supplies; CMOS process; SU IC module; bidirectional data transfer; biomedical implant; inside body power IC module pair; master unit; passive MOS AC-DC converter; power conversion; satellite unit; size 0.18 mum; three-phase signal; Demodulation; Downlink; Driver circuits; Integrated circuits; Timing; Wires; AC–DC converter; biomedical; data modulation and demodulation; power delivery;

fLanguage

English

Journal_Title

Solid-State Circuits, IEEE Journal of

Publisher

ieee

ISSN

0018-9200

Type

jour

DOI

10.1109/JSSC.2011.2157260

Filename

5875909