Title :
An Inside Body Power and Bidirectional Data Transfer IC Module Pair
Author_Institution :
Alfred Mann Found., Santa Clarita, CA, USA
Abstract :
An IC module pair utilizing only three wires was designed for biomedical implants with a master unit (MU) and a small, lightweight satellite unit (SU). Power was delivered from the MU to the SU using a three-phase signal and converted to dc in the SU IC module by a passive MOS ac-dc converter. Bidirectional data transfer between the two units was achieved by modulating the amplitudes (at periods that do not affect power delivery) and the positions of the rising and falling edges of the three-phase signal. A bidirectional data rate in the range of MB/s and an overall power efficiency of 90.2% for a 2.84-mW load were achieved in a 0.18-μm CMOS process.
Keywords :
AC-DC power convertors; CMOS integrated circuits; bioelectric phenomena; prosthetic power supplies; CMOS process; SU IC module; bidirectional data transfer; biomedical implant; inside body power IC module pair; master unit; passive MOS AC-DC converter; power conversion; satellite unit; size 0.18 mum; three-phase signal; Demodulation; Downlink; Driver circuits; Integrated circuits; Timing; Wires; AC–DC converter; biomedical; data modulation and demodulation; power delivery;
Journal_Title :
Solid-State Circuits, IEEE Journal of
DOI :
10.1109/JSSC.2011.2157260
