On the single-chip implementation of a Hiperlan/2 and IEEE 802.11a capable modem

Author

Grass, Eckhard ; Tittelbach-Helmrich, Klaus ; Jagdhold, Ulrich ; Troya, Alfonso ; Lippert, Gunther ; Krüger, Olaf ; Lehmann, Jens ; Maharatna, Koushik ; Dombrowski, Kai F. ; Fiebig, Norbert ; Kraemer, Rolf ; Mähönen, Petri

Volume

8

Issue

6

fYear

2001

fDate

12/1/2001 12:00:00 AM

Firstpage

48

Lastpage

57

Abstract

Broadband wireless communication is the key technology to a new generation of products in the consumer market. The emerging standards for the 5 GHz band will form the basis for many applications requiring a high communication bandwidth. Low cost and low power dissipation will be a prerequisite for most mobile applications. One way to realize low-cost systems is to reduce the system complexity and deploy highly integrated components. The work presented in this article discusses aspects of implementing a complete Hiperlan/2 and IEEE 802.11a compliant modem, including the physical layer as well as the data link control layer, into a single chip

Keywords

BiCMOS integrated circuits; CMOS integrated circuits; IEEE standards; broadband networks; land mobile radio; modems; telecommunication standards; wireless LAN; 5 GHz; BiCMOS technology; CMOS library cells; Hiperlan/2 compliant modem; IEEE 802.11a capable modem; IEEE standards; SHF; broadband wireless communication; consumer market; data link control layer; high communication bandwidth; integrated components; low-cost; mobile applications; physical layer; single-chip implementation; Bit rate; Broadband communication; Communication standards; Mobile communication; Modems; Open systems; Physical layer; Silicon; Wireless LAN; Wireless communication;

fLanguage

English

Journal_Title

Personal Communications, IEEE

Publisher

ieee

ISSN

1070-9916

Type

jour

DOI

10.1109/98.972168

Filename

972168