Millimeter-wave components and subsystems built using microstrip technology

Author

Williams, David A.

Author_Institution

GEC Plessey Semicond., Lincoln, UK

Volume

39

Issue

5

fYear

1991

fDate

5/1/1991 12:00:00 AM

Firstpage

768

Lastpage

774

Abstract

The author describes the evaluation of microstrip as a transmission medium for components and subsystems operating in the millimeter wavebands. The manufacturing process for thin-film MICs on single-crystal quartz is described. The microwave integrated circuit (MIC) manufacturing process is suitable for high-value manufacturing of highly integrated subsystems since manufacturing costs for the circuits are almost independent of the number of circuit functions. Designs for various circuit elements are discussed, and an integrated subsystem is described in which MIC techniques are used to produce a miniature millimeter-wave distance-measuring sensor. Range measurement results for the miniature sensor are presented

Keywords

integrated circuit manufacture; microwave integrated circuits; radar equipment; strip line components; thin film circuits; MM-wave components; SiO₂; coupler; distance-measuring sensor; integrated subsystems; manufacturing process; microstrip technology; microwave integrated circuit; millimeter wavebands; mixers; nonreciprocal devices; oscillators; p-i-n switches; single-crystal quartz; thin-film MICs; Cost function; Integrated circuit manufacture; Manufacturing processes; Microstrip components; Microwave integrated circuits; Millimeter wave integrated circuits; Millimeter wave measurements; Millimeter wave technology; Sensor phenomena and characterization; Thin film circuits;

fLanguage

English

Journal_Title

Microwave Theory and Techniques, IEEE Transactions on

Publisher

ieee

ISSN

0018-9480

Type

jour

DOI

10.1109/22.79103

Filename

79103