Title :
Millimeter-wave components and subsystems built using microstrip technology
Author :
Williams, David A.
Author_Institution :
GEC Plessey Semicond., Lincoln, UK
fDate :
5/1/1991 12:00:00 AM
Abstract :
The author describes the evaluation of microstrip as a transmission medium for components and subsystems operating in the millimeter wavebands. The manufacturing process for thin-film MICs on single-crystal quartz is described. The microwave integrated circuit (MIC) manufacturing process is suitable for high-value manufacturing of highly integrated subsystems since manufacturing costs for the circuits are almost independent of the number of circuit functions. Designs for various circuit elements are discussed, and an integrated subsystem is described in which MIC techniques are used to produce a miniature millimeter-wave distance-measuring sensor. Range measurement results for the miniature sensor are presented
Keywords :
integrated circuit manufacture; microwave integrated circuits; radar equipment; strip line components; thin film circuits; MM-wave components; SiO2; coupler; distance-measuring sensor; integrated subsystems; manufacturing process; microstrip technology; microwave integrated circuit; millimeter wavebands; mixers; nonreciprocal devices; oscillators; p-i-n switches; single-crystal quartz; thin-film MICs; Cost function; Integrated circuit manufacture; Manufacturing processes; Microstrip components; Microwave integrated circuits; Millimeter wave integrated circuits; Millimeter wave measurements; Millimeter wave technology; Sensor phenomena and characterization; Thin film circuits;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
