LED array modules by new technology microbump bonding method

Author

Hatada, Kenzo ; Fujimoto, Hiroaki ; Ochi, Takao ; Ishida, Yoichiro

Author_Institution

Matsushita Electr. Ind. Co. Ltd., Osaka, Japan

Volume

13

Issue

3

fYear

1990

fDate

9/1/1990 12:00:00 AM

Firstpage

521

Lastpage

527

Abstract

An LED array module was developed by using the microbump bonding method by which the electrodes of LSI chips and circuit substrate are press-bonded by utilizing the shrinkage stress produced in a light setting insulating resin. The LED array module has a resolution of 400 DPI, and is constructed by face-down mounting of 54 each of the LED chips and driver LSIs on a glass substrate. These LED chips, having an electrode pitch of 63.5 μm, are disposed on the glass substrate at a pitch of 10 μm. A dedicated bonder was developed for this assembling work. A report on the LED array module assembling process and the construction of a bonder is presented

Keywords

large scale integration; lead bonding; light emitting diodes; modules; 10 micron; 635 micron; LED array modules; LSI chips; circuit substrate; face-down mounting; glass substrate; light setting insulating resin; microbump bonding method; module assembling process; press bonding; shrinkage stress; Assembly; Bonding; Circuits; Electrodes; Glass; Insulation; Large scale integration; Light emitting diodes; Optical arrays; Stress;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.58854

Filename

58854