Solder joint reliability of fine pitch surface mount technology assemblies

Author

Lau, John ; Powers-Maloney, Laura M. ; Baker, James R. ; Rice, Don ; Shaw, Bob

Author_Institution

Hewlett-Packard Co., Palo Alto, CA, USA

Volume

13

Issue

3

fYear

1990

fDate

9/1/1990 12:00:00 AM

Firstpage

534

Lastpage

544

Abstract

The reliability of fine-pitch solder joint interconnection is studied. It consists of two different fine-pitch surface mount components (SMC), namely, the Electronic Industry Associates of Japan (EIAJ) 160-Pin Quad Flat Pack (QFP), and the Joint Electronic Device Engineering Council (JEDEC) 132-Pin Plastic Quad Flat Pack (PQFP). They each have a lead-spacing (from lead-center to lead-center) of approximately 0.025 in. For comparison purposes the conventional JEDEC 68-Pin Plastic Leaded Chip Carrier (PLCC) and the 84-Pin PLCC have also been used in the same manufacturing process. Solder joint reliability of these four SMCs has been quantified for the mechanical shock, mechanical vibration, and thermal environmental stress factors

Keywords

circuit reliability; packaging; soldering; surface mount technology; Electronic Industry Associates of Japan; JEDEC; Joint Electronic Device Engineering Council; Plastic Leaded Chip Carrier; Plastic Quad Flat Pack; Quad Flat Pack; fine pitch surface mount technology assemblies; lead-spacing; mechanical shock; mechanical vibration; reliability; solder joint interconnection; thermal environmental stress; Electronics industry; Electronics packaging; Industrial electronics; Lead; Plastics; Reliability engineering; Sliding mode control; Soldering; Surface-mount technology; Thermal stresses;

fLanguage

English

Journal_Title

Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Publisher

ieee

ISSN

0148-6411

Type

jour

DOI

10.1109/33.58856

Filename

58856