Title :
Mixed-mode correlator for micropower acoustic transient classification
Author :
Edwards, R. Timothy ; Cauwenberghs, Gert
Author_Institution :
Dept. of Electr. & Comput. Eng., Johns Hopkins Univ., Baltimore, MD, USA
fDate :
10/1/1999 12:00:00 AM
Abstract :
A mixed-mode very large scale integration (VLSI) processor for acoustic transient classification performs a running correlation between a time-frequency decomposed analog input signal and a corresponding template. Differential encoding of the inputs allows simplification of the multiply-and-accumulate operations, operating on binary templates and positive-valued inputs, implemented in current mode with eight MOS transistors per cell including SRAM template storage. The use of a bucket-brigade device (BED) instead of a charge-coupled device (CCD) for shift-and-accumulate operations allows long integration times necessary for acoustic transients spanning several hundred milliseconds. Correlated double sampling at the output compensates for dark current losses in the BED and other common-mode effects. The 64×16 time-frequency correlator measures 700 μm×1170 μm in a 1.2-μm CMOS process and dissipates an average of 30 μW in continuous operation
Keywords :
CMOS integrated circuits; VLSI; acoustic signal detection; correlators; current-mode circuits; low-power electronics; mixed analogue-digital integrated circuits; pattern classification; time-frequency analysis; 1.2 micron; 30 muW; CMOS process; SRAM template storage; binary templates; bucket-brigade device; common-mode effects; current mode; dark current losses; differential encoding; integration times; micropower acoustic transient classification; mixed-mode correlator; multiply-and-accumulate operations; positive-valued inputs; running correlation; shift-and-accumulate operations; time-frequency correlator; time-frequency decomposed analog input signal; very large scale integration; Acoustic devices; Charge coupled devices; Correlators; Encoding; MOSFETs; Random access memory; Sampling methods; Signal processing; Time frequency analysis; Very large scale integration;
Journal_Title :
Solid-State Circuits, IEEE Journal of