Title :
Effects of package orientation and mixed convection on heat transfer from a PQFP
Author :
Sikka, Kamal K. ; Fisher, Timothy S. ; Torrance, Kenneth E. ; Lamb, Charles R.
Author_Institution :
Sibley Sch. of Mech. & Aerosp. Eng., Cornell Univ., Ithaca, NY, USA
fDate :
6/1/1997 12:00:00 AM
Abstract :
The thermal resistance of a surface-mount, plastic quad flat package (PQFP) was measured over a range of heating powers, air velocities, and package orientations. The specific package was one developed by a Joint Electronic Device Engineering Council (JEDEC) committee for standardized testing. The package was mounted in a low-speed wind tunnel which could be rotated in a vertical plane, thus changing the orientation of the package with respect to the gravity vector. Results define the limits of mixed convection for a horizontal package, and of orientation effects for package/tunnel orientations from buoyancy-opposing to buoyancy-assisting. For large air velocities greater than 2.5 m/s, for all tunnel orientations, the package thermal resistance shows a steep decrease, which is attributed to restarting of the surface boundary layer on the package
Keywords :
cooling; forced convection; integrated circuit packaging; plastic packaging; surface mount technology; thermal resistance; wind tunnels; JEDEC; PQFP; SMT; air velocities; buoyancy-assisting; buoyancy-opposing; gravity vector; heat transfer; heating powers; low-speed wind tunnel; mixed convection; orientation effects; package orientation; surface boundary layer; thermal resistance; Councils; Electrical resistance measurement; Electronic equipment testing; Electronic packaging thermal management; Plastic packaging; Power engineering and energy; Resistance heating; Surface resistance; Thermal resistance; Velocity measurement;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part A, IEEE Transactions on