DocumentCode :
1557300
Title :
DC power-bus modeling and design with a mixed-potential integral-equation formulation and circuit extraction
Author :
Fan, Jun ; Drewniak, James L. ; Shi, Hao ; Knighten, James L.
Author_Institution :
Electromagn. Compatibility Lab., Missouri Univ., Rolla, MO, USA
Volume :
43
Issue :
4
fYear :
2001
fDate :
11/1/2001 12:00:00 AM
Firstpage :
426
Lastpage :
436
Abstract :
The application of a circuit extraction approach based on a mixed-potential integral equation formulation (CEMPIE) for DC power-bus modeling in high-speed digital designs is detailed. Agreement with measurements demonstrates the effectiveness of the approach. Dielectric losses are included into the calculation of the Green´s functions, and thus, incorporated into the rigorous first principles formulation. A SPICE model is then extracted from the discretized integral equation. A quasistatic approximation is used for the Green´s functions to keep the extracted circuit elements frequency independent. Previous work has established a necessary meshing criterion in order to ensure accuracy for a given substrate thickness and dielectric constant to a desired frequency. Several power-bus design issues, such as surface mount decoupling and power-plane segmentation, were investigated using the modeling approach. The results and discussions illustrate the application of the method to DC power-bus design for printed circuit and multi-chip module substrates
Keywords :
Green´s function methods; SPICE; approximation theory; circuit CAD; dielectric losses; digital circuits; integral equations; multichip modules; printed circuit design; DC power-bus design; DC power-bus modeling; Green´s functions; SPICE model; circuit extraction; dielectric constant; dielectric losses; frequency independent circuit elements; high-speed digital design; mixed-potential integral-equation; multichip module substrates; necessary meshing criterion; power-plane segmentation; quasistatic approximation; substrate thickness; surface mount decoupling; Capacitors; Circuit noise; Dielectric losses; Dielectric substrates; Electromagnetic compatibility; Equivalent circuits; Frequency; Integral equations; Printed circuits; SPICE;
fLanguage :
English
Journal_Title :
Electromagnetic Compatibility, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9375
Type :
jour
DOI :
10.1109/15.974622
Filename :
974622
Link To Document :
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