Frequency-dependent losses on high-performance interconnections

Author

Deutsch, Alina ; Kopcsay, Gerard V. ; Coteus, Paul W. ; Surovic, Christopher W. ; Dahlen, Paul E. ; Heckmann, David L. ; Duan, Dah-Weih

Author_Institution

Div. of Res., IBM Thomas J. Watson Res. Center, Yorktown Heights, NY, USA

Volume

43

Issue

4

fYear

2001

fDate

11/1/2001 12:00:00 AM

Firstpage

446

Lastpage

465

Abstract

This paper compares the major classes of chip-to-chip and on-chips interconnections used in high-performance computers and communication systems and reviews their electrical characteristics. Measurement results of dielectric loss are shown and the attenuation is compared for printed-circuit-board, glass-ceramic, thin-film, and on-chip wiring. Simulation results are shown with representative driver and receiver circuits, guidelines are given for when losses are significant, and predictions are made for the sustainable bandwidths on useful wiring lengths

Keywords

dielectric loss measurement; driver circuits; glass ceramics; integrated circuit interconnections; printed circuit testing; printed circuits; thin film circuits; PCB; attenuation; bandwidth; chip-to-chip interconnections; dielectric loss; driver circuits; electrical characteristics; frequency-dependent losses; high-performance communication systems; high-performance computers; high-performance interconnections; on-chips interconnections; printed circuit board; printed-circuit-board; pulse distortion; receiver circuits; simulation results; wiring lengths; Attenuation measurement; Dielectric loss measurement; Dielectric measurements; Electric variables; Frequency; Integrated circuit interconnections; Loss measurement; Semiconductor device measurement; System-on-a-chip; Wiring;

fLanguage

English

Journal_Title

Electromagnetic Compatibility, IEEE Transactions on

Publisher

ieee

ISSN

0018-9375

Type

jour

DOI

10.1109/15.974624

Filename

974624