Proportional difference estimate method for bimodal and multimodal failure distributions

Author

Mu, Fuchen ; Tan, Changhua ; Xu, Mingzhen

Author_Institution

Inst. of Microelectron., Peking Univ., Beijing, China

Volume

48

Issue

12

fYear

2001

fDate

12/1/2001 12:00:00 AM

Firstpage

2740

Lastpage

2745

Abstract

Peaks appear after proportional differentiation of cumulative distribution functions of Weibull and lognormal distributions. The characteristic parameters can be extracted from the proportional difference peaks because these peaks are related to the characteristic parameters directly. On this basis, a simple method known as the proportional difference estimate (PDE) method for determining the characteristic parameters of multimodal failure distributions was developed. This method can be applied to microelectronics dielectric and interconnect reliability studies

Keywords

Weibull distribution; dielectric thin films; difference equations; electromigration; failure analysis; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; log normal distribution; PDE method; Weibull distributions; bimodal failure distributions; characteristic parameter extraction; characteristic parameters; cumulative distribution functions; dielectric reliability; electromigration; interconnect reliability; lognormal distributions; multimodal failure distributions; proportional difference estimate; proportional difference estimate method; proportional difference operator; proportional difference peaks; proportional differentiation; time-dependent dielectric breakdown; Algorithm design and analysis; Dielectric breakdown; Distribution functions; Electric breakdown; Extrapolation; Graphics; Maximum likelihood estimation; Shape; Statistical distributions; Weibull distribution;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/16.974698

Filename

974698