DocumentCode
1557535
Title
Study of low-frequency charge pumping on thin stacked dielectrics
Author
Weintraub, Chad E. ; Vogel, Eric ; Hauser, John R. ; Yang, Nian ; Misra, Veena ; Wortman, Jimmie J. ; Ganem, J. ; Masson, Pascal
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Volume
48
Issue
12
fYear
2001
fDate
12/1/2001 12:00:00 AM
Firstpage
2754
Lastpage
2762
Abstract
The application of low-frequency charge pumping to obtain near-interface, or bulk trap densities, on thin stacked gate dielectrics is studied. A review of the theory governing the low-frequency charge pumping technique, developed to extract bulk trap densities from metal-oxide-semiconductor field-effect transistors (MOSFETs) fabricated with thick SiO2 dielectrics, is given. In this study, the technique is applied to a series of n-channel MOSFETs fabricated with stacked gate dielectrics. The dielectric stacks were comprised of rapid thermal oxide (RTO) interface layers and rapid thermal chemical vapor deposited (RTCVD) oxynitride layers, which incorporated varying concentrations of nitrogen. The effect of DC tunneling currents on the technique is studied, and a procedure to remove these components from the measured substrate current is outlined. Distortions in the experimentally measured charge pumping current plotted as a function of gate bias is modeled and found to be due to the contribution of bulk traps. Finally, the limitations of applying a model that was originally developed for thick SiO2 dielectrics to thin stacked gate dielectrics are discussed
Keywords
MOSFET; chemical vapour deposition; dielectric thin films; electric current; electron traps; hole traps; interface states; oxidation; rapid thermal processing; semiconductor device measurement; semiconductor device models; DC tunneling currents; MOSFETs; RTCVD; RTO; SiO2-SiON; bulk trap densities; bulk traps; charge pumping; charge pumping current; dielectric stacks; gate bias; interface traps; low-frequency charge pumping; metal-oxide-semiconductor field-effect transistors; model; n-channel MOSFETs; near-interface trap densities; near-interface traps; nitrogen concentration; rapid thermal chemical vapor deposited oxynitride layers; rapid thermal oxide interface layers; stacked gate dielectrics; substrate current; thick SiO2 dielectrics; thin stacked gate dielectrics; Charge pumps; Chemicals; Current measurement; Dielectric measurements; Dielectric substrates; Distortion measurement; FETs; MOSFETs; Nitrogen; Tunneling;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.974700
Filename
974700
Link To Document