• DocumentCode
    1557535
  • Title

    Study of low-frequency charge pumping on thin stacked dielectrics

  • Author

    Weintraub, Chad E. ; Vogel, Eric ; Hauser, John R. ; Yang, Nian ; Misra, Veena ; Wortman, Jimmie J. ; Ganem, J. ; Masson, Pascal

  • Author_Institution
    Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
  • Volume
    48
  • Issue
    12
  • fYear
    2001
  • fDate
    12/1/2001 12:00:00 AM
  • Firstpage
    2754
  • Lastpage
    2762
  • Abstract
    The application of low-frequency charge pumping to obtain near-interface, or bulk trap densities, on thin stacked gate dielectrics is studied. A review of the theory governing the low-frequency charge pumping technique, developed to extract bulk trap densities from metal-oxide-semiconductor field-effect transistors (MOSFETs) fabricated with thick SiO2 dielectrics, is given. In this study, the technique is applied to a series of n-channel MOSFETs fabricated with stacked gate dielectrics. The dielectric stacks were comprised of rapid thermal oxide (RTO) interface layers and rapid thermal chemical vapor deposited (RTCVD) oxynitride layers, which incorporated varying concentrations of nitrogen. The effect of DC tunneling currents on the technique is studied, and a procedure to remove these components from the measured substrate current is outlined. Distortions in the experimentally measured charge pumping current plotted as a function of gate bias is modeled and found to be due to the contribution of bulk traps. Finally, the limitations of applying a model that was originally developed for thick SiO2 dielectrics to thin stacked gate dielectrics are discussed
  • Keywords
    MOSFET; chemical vapour deposition; dielectric thin films; electric current; electron traps; hole traps; interface states; oxidation; rapid thermal processing; semiconductor device measurement; semiconductor device models; DC tunneling currents; MOSFETs; RTCVD; RTO; SiO2-SiON; bulk trap densities; bulk traps; charge pumping; charge pumping current; dielectric stacks; gate bias; interface traps; low-frequency charge pumping; metal-oxide-semiconductor field-effect transistors; model; n-channel MOSFETs; near-interface trap densities; near-interface traps; nitrogen concentration; rapid thermal chemical vapor deposited oxynitride layers; rapid thermal oxide interface layers; stacked gate dielectrics; substrate current; thick SiO2 dielectrics; thin stacked gate dielectrics; Charge pumps; Chemicals; Current measurement; Dielectric measurements; Dielectric substrates; Distortion measurement; FETs; MOSFETs; Nitrogen; Tunneling;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.974700
  • Filename
    974700