Title :
Fast turn on/off low noise amplifier for duty cycled ultra-wideband impulse radio
Author :
Benamor, I. ; Dehaese, Nicolas ; Gaubert, Jean ; Bourdel, Sylvain
Author_Institution :
Aix-Marseille Univ., Marseille, France
Abstract :
This paper is concerned with the analysis of the effect of packaging solution on the turn On/Off time of a Low Noise Amplifier (LNA) for 6-10 GHz duty cycled Impulse-Radio Ultra Wideband applications. The circuit turn On/Off time is conditioning by two terms. The first one is related to the time required by the internal LNA architecture to establish the biasing operating points. The second one is dependent with the choice of the packaging solution. The inductance effects of bonding on the turn On/Off time are then introduced. Next, a method for calculating the on-chip decoupling capacitor and the damping resistor is presented. The proposed method allows obtaining a fast turn On/Off time. The LNA is implemented in a 0.13 μm CMOS process from STMicroelectronics with 1.2 V supply voltage. Simulation results show that the LNA achieves a differential voltage gain about 37 dB with 3 dB noise figure. The LNA output voltage is settled within 2ns with only 29.5 μW power when it is duty cycled@100kbps.
Keywords :
CMOS analogue integrated circuits; integrated circuit packaging; low noise amplifiers; radiofrequency integrated circuits; ultra wideband technology; CMOS process; STMicroelectronics; biasing operating points; bit rate 100 kbit/s; circuit turn on-off time; damping resistor; duty cycled impulse-radio ultra wideband applications; duty cycled ultra-wideband impulse radio; fast turn on-off low noise amplifier; frequency 6 GHz to 10 GHz; inductance effects; internal LNA architecture; noise figure 3 dB; on-chip decoupling capacitor; packaging solution effect analysis; power 29.5 muW; size 0.13 mum; time 2 ns; voltage 1.2 V; Capacitors; Computer architecture; Delays; Packaging; Power supplies; Transistors; Ultra wideband technology; IR-UWB; Low Noise Amplifier (LNA); Low Power consumption; Packaging solution; Power Manegement;
Conference_Titel :
Ultra-WideBand (ICUWB), 2014 IEEE International Conference on
Conference_Location :
Paris
DOI :
10.1109/ICUWB.2014.6959002
