• DocumentCode
    1557719
  • Title

    On the performance advantage of PD/SOI CMOS with floating bodies

  • Author

    Pelella, Mario M. ; Fossum, Jerry G.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Florida Univ., Gainesville, FL, USA
  • Volume
    49
  • Issue
    1
  • fYear
    2002
  • fDate
    1/1/2002 12:00:00 AM
  • Firstpage
    96
  • Lastpage
    104
  • Abstract
    The performance advantage of floating-body (FB) partially depleted (PD) SOI CMOS technology is analyzed via device/circuit simulations, with emphasis on providing insight into the physical mechanisms underlying the advantage. Comparisons of predicted propagation delay of contemporary and scaled FB PD/SOI CMOS, including hysteresis, with those of the bulk-Si and body-tied-to-source/SOI counterparts, all with controlled off-state current, are made, and the impact of junction capacitance, the kink effect, and capacitive-coupling effects are quantified. Scaling the technologies is shown to diminish the performance advantage of FB PD/SOI CMOS, but this tendency can be mitigated by typically elevated operating temperatures, stacked-transistor logic, and device-design optimization
  • Keywords
    CMOS integrated circuits; capacitance; delays; hysteresis; integrated circuit modelling; integrated circuit technology; semiconductor device models; silicon-on-insulator; PD/SOI MOSFETs; Si; capacitive-coupling effects; circuit simulation; controlled off-state current; device design optimization; device simulation; elevated operating temperatures; floating-body PD SOI CMOS technology; hysteresis; junction capacitance; kink effect; partially depleted SOI CMOS technology; performance advantage; process-based UFSOI compact model; propagation delay; stacked-transistor logic; technology scaling; unified model; CMOS technology; Capacitance; Circuit simulation; Coupling circuits; Hysteresis; MOSFET circuits; Radiative recombination; Semiconductor device modeling; Temperature; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.974755
  • Filename
    974755