Title :
Measurement of temperature in active high-power AlGaN/GaN HFETs using Raman spectroscopy
Author :
Kuball, M. ; Hayes, J.M. ; Uren, M.J. ; Martin, I. ; Birbeck, J.C.H. ; Balmer, R.S. ; Hughes, B.T.
Author_Institution :
H.H. Wills Phys. Lab., Bristol Univ., UK
Abstract :
We report on the noninvasive measurement of temperature, i.e., self-heating effects, in active AlGaN/GaN HFETs grown on sapphire and SiC substrates. Micro-Raman spectroscopy was used to produce temperature maps with /spl ap/1 μm spatial resolution and a temperature accuracy of better than 10/spl deg/C. Significant temperature rises up to 180/spl deg/C were measured in the device gate-drain opening. Results from a three-dimensional (3-D) heat dissipation model are in reasonably good agreement with the experimental data. Comparison of devices fabricated on sapphire and SiC substrates indicated that the SiC substrate devices had /spl sim/5 times lower thermal resistance.
Keywords :
III-V semiconductors; Raman spectroscopy; aluminium compounds; gallium compounds; microwave field effect transistors; microwave power transistors; power field effect transistors; sapphire; semiconductor device measurement; silicon compounds; spectral methods of temperature measurement; temperature distribution; thermal analysis; thermal resistance; wide band gap semiconductors; 3D heat dissipation model; Al/sub 2/O/sub 3/; AlGaN-GaN; SiC; SiC substrates; device gate-drain opening; high-power AlGaN/GaN HFETs; micro-Raman spectroscopy; noninvasive measurement; reliability; sapphire substrates; self-heating effects; temperature accuracy; temperature maps; temperature measurement; thermal resistance; Aluminum gallium nitride; Gallium nitride; HEMTs; MODFETs; Noninvasive treatment; Silicon carbide; Spatial resolution; Spectroscopy; Temperature measurement; Thermal resistance;
Journal_Title :
Electron Device Letters, IEEE