Title :
Development of micromanipulator and haptic interface for networked micromanipulation
Author :
Ando, Noriaki ; Korondi, Péter ; Hashimoto, Hideki
Author_Institution :
Inst. of Ind. Sci., Tokyo Univ., Japan
fDate :
12/1/2001 12:00:00 AM
Abstract :
Telemicromanipulation systems with haptic feedback, which are connected through a network, are proposed. It is based on scaled bilateral teleoperation systems between different structures. These systems are composed of an original 6 degree of freedom (DOF) parallel link manipulator to carry out micromanipulation and a 6-DOF haptic interface with force feedback. A parallel mechanism is adopted as a slave micromanipulator because of its good features of accuracy and stiffness. The system modeling and control of the parallel manipulator system are conducted. Parallel manipulator feasibility as a micromanipulator, positioning accuracy and device control characteristics are investigated. A haptic master interface is developed for micromanipulation systems. System modeling and a model reference adaptive controller are applied to compensate friction force, which spoils free motion performance and force response isotropy of the haptic interface. These systems aim to make the micromanipulation more productive constructing a better human interface through the microenvironment force and scale expansion
Keywords :
Internet; compensation; force feedback; groupware; haptic interfaces; manipulator kinematics; micromanipulators; model reference adaptive control systems; position control; telerobotics; device control characteristics; force feedback; force response isotropy; free motion performance; haptic feedback; haptic interface; model reference adaptive controller; networked micromanipulation; parallel link manipulator; positioning accuracy; scaled bilateral teleoperation systems; telemicromanipulation systems; Adaptive control; Control system synthesis; Force control; Force feedback; Friction; Haptic interfaces; Micromanipulators; Modeling; Motion control; Programmable control;
Journal_Title :
Mechatronics, IEEE/ASME Transactions on
DOI :
10.1109/3516.974855