Title :
Foreword thermal investigations of ICs and systems (THERMINIC)
Author :
Courtois, B. ; Lasance, C.J.M.
Author_Institution :
Tima Laboratory
Keywords :
Components, packaging, and manufacturing technology; Conferences; Electronic packaging thermal management; Laboratories; Paper technology; Steady-state; Temperature measurement; Testing; Thermal conductivity; Thermal management;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2001.974940
