• DocumentCode
    1558132
  • Title

    Foreword thermal investigations of ICs and systems (THERMINIC)

  • Author

    Courtois, B. ; Lasance, C.J.M.

  • Author_Institution
    Tima Laboratory
  • Volume
    24
  • Issue
    4
  • fYear
    2001
  • Firstpage
    547
  • Lastpage
    548
  • Keywords
    Components, packaging, and manufacturing technology; Conferences; Electronic packaging thermal management; Laboratories; Paper technology; Steady-state; Temperature measurement; Testing; Thermal conductivity; Thermal management;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2001.974940
  • Filename
    974940
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1558132