Title :
MECHATRONICS 2000. Seventh Mechatronics Forum International Conference and Mechatronics Education Workshop
fDate :
12/1/2001 12:00:00 AM
Abstract :
The following topics are dealt with: flip chip solder joint quality inspection; direct chip attach packaging for microsystems; reliability analysis of no-underfill flip chip package; ASIC/memory integration by system-on-package; wafer-level and flip chip designs through solder prediction models and validation; reliability evaluation of under bump metallurgy in two solder systems; a method to improve the efficiency of the CMP process; thermal and reliability analysis of packaging systems
Keywords :
assembling; flip-chip devices; mechatronics; packaging; reliability; soldering; thermal analysis; CMP process; direct chip attach packaging; flip chip packaging; mechatronics; microsystems; reliability analysis; solder joint; thermal modelling; under bump metallurgy; wafer level designs; Boundary conditions; Finite element methods; Geometry; Impedance; Material properties; Packaging; Polymers; Steady-state; Testing; Thermal resistance;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.974942
