DocumentCode

1558147

Title

Foreword

Author

Ume, I.C.

Author_Institution

Georgia Institute of Technology

Volume

24

Issue

4

fYear

2001

Firstpage

614

Lastpage

615

Keywords

Assembly; Chip scale packaging; Educational programs; Educational technology; Flip chip; Lead; Mechatronics; Predictive models; Soldering; Thermal stresses;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2001.974949

Filename

974949