• DocumentCode
    1558162
  • Title

    Sticking effect on center-anchored circular plates in microstructures

  • Author

    Lin, Meng-Ju ; Chen, Rongshun

  • Author_Institution
    Dept. of Power Mech. Eng., Nat. Tsing Hua Univ., Hsinchu, Taiwan
  • Volume
    24
  • Issue
    4
  • fYear
    2001
  • fDate
    12/1/2001 12:00:00 AM
  • Firstpage
    645
  • Lastpage
    649
  • Abstract
    In wet etching and cleaning processes of surface micromachining fabrications, a circular plate may adhere to its underlying substrate due to the capillary force of liquid. This paper studied the sticking effect between a center-anchored circular plate and its underlying substrate. Using the balance of capillary and elastic forces, we derived a critical gap for adhesion in terms of the parameters: gap between the plate and substrate, anchor radius, and outer radius of plate. This critical gap can be used to judge the potential sticking effect between the plate and substrate. Applying energy method, we derived another critical gap of adhesion, which determines the condition for releasing the circular plate from the underlying substrate by elastic force. Based on the two critical gaps, the sticking effect due to the plate thickness, surface tension of liquid, and two material properties: Young´s modulus and Poisson´s ratio is also discussed
  • Keywords
    Poisson ratio; Young´s modulus; adhesion; capillarity; force; micromechanical devices; surface tension; MEMS; Poisson ratio; Young´s modulus; adhesion; anchor radius; capillary force; center-anchored circular plates; cleaning processes; critical gap; elastic forces; material properties; microstructures; plate outer radius; plate thickness; sticking effect; surface micromachining fabrications; surface tension; underlying substrate; wet etching; Adhesives; Cleaning; Degradation; Fabrication; Laser radar; Material properties; Micromachining; Microstructure; Surface tension; Wet etching;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/6144.974955
  • Filename
    974955