DocumentCode :
1558190
Title :
Parameter recharacterization: a method of thermal uprating
Author :
Das, Diganta ; Pendsé, Neeraj ; Wilkinson, Chris ; Pecht, Michael G.
Author_Institution :
CALCE Electron. Products & Syst. Center, Maryland Univ., College Park, MD, USA
Volume :
24
Issue :
4
fYear :
2001
fDate :
12/1/2001 12:00:00 AM
Firstpage :
729
Lastpage :
737
Abstract :
The availability of electronic parts rated for operating temperature ranges wider than 0-70°C (commercial temperature range) is decreasing, as semiconductor manufacturers are prone to test and rate parts only in terms of "commercial" applications (e.g., consumer and computer products). Nevertheless, there is a need for parts requiring a larger operating temperature range, especially in avionics, military, automotive and oil drilling electronics. This paper presents a "parameter recharacterization" method for part use outside part manufacturer\´s specified temperature range. Cautions that need to be undertaken for successful parameter recharacterization are also presented
Keywords :
characteristics measurement; conformance testing; integrated circuit testing; production testing; semiconductor device testing; electronic parts; operating temperature ranges; parameter conformance; parameter recharacterization; point selection; semiconductor manufacturers; stress balancing; thermal uprating; Aerospace electronics; Application software; Automotive engineering; Computer aided manufacturing; Electronic equipment testing; Military computing; Oil drilling; Semiconductor device manufacture; Semiconductor device testing; Temperature distribution;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.974967
Filename :
974967
Link To Document :
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