Abstract :
On-chip micronetworks, designed with a layered methodology, will meet the distinctive challenges of providing functionally correct, reliable operation of interacting system-on-chip components. A system on chip (SoC) can provide an integrated solution to challenging design problems in the telecommunications, multimedia, and consumer electronics domains. Much of the progress in these fields hinges on the designers´ ability to conceive complex electronic engines under strong time-to-market pressure. Success will require using appropriate design and process technologies, as well as interconnecting existing components reliably in a plug-and-play fashion. Focusing on using probabilistic metrics such as average values or variance to quantify design objectives such as performance and power will lead to a major change in SoC design methodologies. Overall, these designs will be based on both deterministic and stochastic models. Creating complex SoCs requires a modular, component-based approach to both hardware and software design. Despite numerous challenges, the authors believe that developers will solve the problems of designing SoC networks. At the same time, they believe that a layered micronetwork design methodology will likely be the only path to mastering the complexity of future SoC designs
Keywords :
hardware-software codesign; microprocessor chips; multiprocessor interconnection networks; reconfigurable architectures; SoC design methodologies; SoC paradigm; average values; complex SoCs; complex electronic engines; design objectives; deterministic models; future SoC designs; hardware design; integrated solution; interacting system-on-chip components; interconnecting components; layered methodology; layered micronetwork design methodology; modular component-based approach; networks on chips; on-chip micronetworks; plug-and-play fashion; probabilistic metrics; process technologies; software design; stochastic models; system on chip; time-to-market pressure; Consumer electronics; Design methodology; Engines; Fasteners; Multimedia systems; Network-on-a-chip; Process design; System-on-a-chip; Telecommunication network reliability; Time to market;