Integrated capacitors for conductive lithographic film circuits

Author

Harrey, Paul M. ; Evans, Peter S A ; Harrison, David J.

Author_Institution

Dept. of Design, Brunel Univ., Uxbridge, UK

Volume

24

Issue

4

fYear

2001

fDate

10/1/2001 12:00:00 AM

Firstpage

333

Lastpage

338

Abstract

This paper reports on fabrication of low-value embedded capacitors in conductive lithographic film (CLF) circuit boards. The CLF process is a low-cost and high speed manufacturing technique for flexible circuits and systems. We report on the construction and electrical characteristics of CLF capacitor structures printed onto flexible substrates. These components comprise a single polyester dielectric layer, which separates the printed electrode films. Multilayer circuit boards with printed components and interconnect can be fabricated using this technique

Keywords

capacitors; electrodes; packaging; printed circuit manufacture; CLF process; conductive lithographic film circuits; electrical characteristics; flexible circuits; flexible substrates; high speed manufacturing technique; low-value embedded capacitors; multilayer circuit boards; polyester dielectric layer; printed electrode films; Capacitors; Circuits and systems; Conductive films; Dielectric substrates; Electric variables; Electrodes; Fabrication; Flexible manufacturing systems; Flexible printed circuits; Manufacturing processes;

fLanguage

English

Journal_Title

Electronics Packaging Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

1521-334X

Type

jour

DOI

10.1109/6104.980043

Filename

980043