DocumentCode :
15599
Title :
Pin Assignment Optimization for Large-Scale High-Pin-Count BGA Packages Using Genetic Algorithm
Author :
Zhuo-Yue Li ; Mu-Shui Zhang
Author_Institution :
Dept. of Electron. & Commun. Eng., Sun Yat-sen Univ., Guangzhou, China
Volume :
5
Issue :
2
fYear :
2015
fDate :
Feb. 2015
Firstpage :
232
Lastpage :
244
Abstract :
In this paper, a power/ground (P/G) pin optimization method using genetic algorithm (GA) is proposed for large-scale high-pin-count ball grid array (BGA) packages. Two objective functions are derived for signal integrity and power integrity, respectively. A general optimization flow is presented, where the basic concepts of GA optimization are introduced and some important considerations for package design are demonstrated. A customized GA flow and two accelerating strategies are developed to improve the efficiency of the optimization procedure. Using GA optimization, the P/G pin assignment of a 40 × 40 BGA package with blocks of core, inputs/outputs and differential pairs can be generated in a few tens of minutes automatically.
Keywords :
ball grid arrays; genetic algorithms; integrated circuit packaging; GA optimization flow; P/G pin assignment optimization; core block; differential pair; genetic algorithm; large-scale high-pin-count BGA package; large-scale high-pin-count ball grid array package; package design; power integrity; power/ground pin optimization method; signal integrity; Biological cells; Genetic algorithms; Inductance; Linear programming; Optimization; Pins; Silicon; Ball grid array (BGA) package; pin assignment; signal integrity (SI); system in package (SiP); system in package (SiP).;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2014.2386855
Filename :
7008440
Link To Document :
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