DocumentCode
1560252
Title
Foreword contributions from the 50th electronic components and technology conference
Author
Boudreau, Richard
Author_Institution
Amp, Inc.
Volume
24
Issue
4
fYear
2001
Firstpage
418
Lastpage
418
Keywords
Connectors; Electronic components; Helium; Lasers and Electro-Optics Society; Manufacturing; Optical transmitters; Packaging; Silicon; Substrates; Wavelength division multiplexing;
fLanguage
English
Journal_Title
Advanced Packaging, IEEE Transactions on
Publisher
ieee
ISSN
1521-3323
Type
jour
DOI
10.1109/TADVP.2001.982823
Filename
982823
Link To Document