Title :
Foreword contributions from the 50th electronic components and technology conference
Author :
Boudreau, Richard
Author_Institution :
Amp, Inc.
Keywords :
Connectors; Electronic components; Helium; Lasers and Electro-Optics Society; Manufacturing; Optical transmitters; Packaging; Silicon; Substrates; Wavelength division multiplexing;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/TADVP.2001.982823
