Title :
Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface
Author :
Iwasaki, Noboru ; Yanagibashi, Mitsuaki ; Tsunetsugu, Hideki ; Kato, Kazutoshi ; Ishitsuka, Fuminori ; Hosoya, Masakaze ; Kikuchi, Hiroyuki
Author_Institution :
NTT Telecommun. Energy Labs., Kanagawa, Japan
fDate :
11/1/2001 12:00:00 AM
Abstract :
A compact 40-Gb/s optical receiver module with an MU-connector interface has been developed. Its packaging has three main technical features. (1) Coplanar waveguide (CPW) patterns of the waveguide photodiode (WG-PD) and of the preamplifier IC in the facing area of the flip-chip structure are optimized for impedance matching. (2) A film carrier is used to connect the preamplifier IC to an electrical coaxial connector for electrical signal output. (3) An MU-connector is used as the optical interface to reduce the module size. Optimum design enabled a module size of 14.0 mm wide, 40.4 mm long, and 9.65 mm high. Measurements showed a 3-dB down bandwidth of the optical/electrical response of at least 50 GHz and a clear open eye pattern for a 40-Gb/s nonreturn-to-zero (NRZ) signal input. This optical receiver module is suitable for large-capacity communication network systems
Keywords :
coplanar waveguides; flip-chip devices; impedance matching; optical couplers; optical fibre networks; optical receivers; packaging; preamplifiers; 40 Gbit/s; 50 GHz; MU-connector; MU-connector interface; coplanar waveguide patterns; electrical coaxial connector; facing area; flip-chip structure; impedance matching; large-capacity communication network; open eye pattern; optical interface; optical receiver module; packaging technology; preamplifier IC; waveguide photodiode; Coaxial components; Coplanar waveguides; Impedance matching; Integrated circuit packaging; Optical films; Optical receivers; Optical waveguides; Photodiodes; Photonic integrated circuits; Preamplifiers;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.982825
