DocumentCode :
1560259
Title :
Foreword
Author :
Elshabini, A.
Author_Institution :
University of Arkansas
Volume :
24
Issue :
4
fYear :
2001
Firstpage :
463
Lastpage :
463
Keywords :
CMOS technology; Components, Packaging, and Manufacturing Technology Society; Electrical engineering; Frequency; Manufacturing processes; Mass production; Microelectronics; Microprocessors; Packaging; Production systems;
fLanguage :
English
Journal_Title :
Advanced Packaging, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3323
Type :
jour
DOI :
10.1109/TADVP.2001.982830
Filename :
982830
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=1560259