High performance package designs for a 1 GHz microprocessor

Author

Hasan, Altaf ; Sarangi, Ananda ; Baldwin, Christopher S. ; Sankman, Robert L. ; Taylor, Gregory F.

Author_Institution

Intel Corp., Chandler, AZ, USA

Volume

24

Issue

4

fYear

2001

fDate

11/1/2001 12:00:00 AM

Firstpage

470

Lastpage

476

Abstract

This paper describes the architecture and design of an organic land grid array (OLGA) and a flip chip pin grid array (FCPGA) package for a 32 b microprocessor with a clock frequency of 1 GHz and an I/O bus designed to run at 133 MHz. Cost and performance targets and compatibility with existing systems are the key accomplishments of this design project. Issues and implementation details of each of these aspects are discussed and contrasted here. This paper concentrates on the processor performance issues associated with the package routing and power delivery. To overcome high inductance associated with the socket and package pins in the FCPGA package, decoupling capacitors were placed on the underside of the package substrate. This paper discusses an optimal placement scheme for the capacitors and their effectiveness in performance improvement of the system compared to the OLGA package case

Keywords

capacitors; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; microprocessor chips; thermal management (packaging); 1 GHz; 32 bit; decoupling capacitors; directly socketable package; flip chip pin grid array; four-layer organic laminated substrate; high density interconnect rules; high inductance; high performance package designs; implementation; low power supply; microprocessor; multilayer package; optimal placement scheme; organic land grid array; package routing; plated through hole vias; power delivery; processor performance; single-edge connector cartridge; six-layer laminated printed circuit board; surface mounted; thermal management; Capacitors; Clocks; Costs; Electronics packaging; Flip chip; Frequency; Inductance; Microprocessors; Routing; Sockets;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.982832

Filename

982832