• DocumentCode
    1560268
  • Title

    Empirical equations on electrical parameters of coupled microstrip lines for crosstalk estimation in printed circuit board

  • Author

    Sohn, Young-Soo ; Lee, Jeong-Cheol ; Park, Hong-June ; Cho, Soo-In

  • Author_Institution
    Dept. of Electr. Eng., Pohang Univ. of Sci. & Technol., South Korea
  • Volume
    24
  • Issue
    4
  • fYear
    2001
  • fDate
    11/1/2001 12:00:00 AM
  • Firstpage
    521
  • Lastpage
    527
  • Abstract
    Empirical equations for the self and mutual capacitance and inductance (Cs, Cm, Ls, Lm) of coupled microstrip lines in a printed circuit board were derived from the numerical simulation results to reduce the computation time for crosstalk estimation. Comparison of the measured Cs, Cm , Ls and Lm values with the derived empirical equations showed good agreements. Also in the near-end and far-end crosstalks, good agreements were obtained between measurements and the derived empirical equations. Microstrip lines embedded in the homogeneous dielectric material as well as those in the inhomogeneous medium with one side exposed to air were considered in this work. Based on the derived empirical equations, a design guide on the spacing between microstrip lines was established
  • Keywords
    capacitance; coupled transmission lines; crosstalk; equivalent circuits; inductance; interconnections; microstrip lines; printed circuit design; transmission line theory; PCB design guide; coupled microstrip lines; crosstalk estimation; embedded microstrip lines; empirical equations; far-end crosstalk; homogeneous dielectric material; inhomogeneous medium; interconnect; line spacing design guideline; mutual capacitance; mutual inductance; near-end crosstalk; numerical simulation; printed circuit board; self capacitance; self inductance; signal integrity; Capacitance; Coupling circuits; Crosstalk; Dielectric measurements; Equations; Inductance; Microstrip; Mutual coupling; Numerical simulation; Printed circuits;
  • fLanguage
    English
  • Journal_Title
    Advanced Packaging, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3323
  • Type

    jour

  • DOI
    10.1109/6040.982839
  • Filename
    982839