Experimental modeling, repeatability investigation and optimization of microwave bond wire interconnects

Author

Sutono, Albert ; Cafaro, N. Gio ; Laskar, Joy ; Tentzeris, Manos M.

Author_Institution

RF Solutions Inc., Atlanta, GA, USA

Volume

24

Issue

4

fYear

2001

fDate

11/1/2001 12:00:00 AM

Firstpage

595

Lastpage

603

Abstract

We present the first comprehensive experimental characterization of bond wire interconnects at microwave frequencies which includes a repeatability study, modeling and optimization. Wire bond interconnects with two different bond types (ball-crescent and wedge), two different loop types (tight and loose) and two different lengths (15 and 25 mils), were fabricated and experimentally investigated. We report the performance and repeatability comparison of these configurations and develop an electromagnetic as well as a simple wide band lumped-element equivalent circuit model to 40 GHz. A novel ribbon bond interconnect topology has also been proposed and experimentally tested demonstrating 65% less reflection compared to the conventional bond wire or ribbon configuration

Keywords

equivalent circuits; interconnections; lead bonding; microwave circuits; modelling; optimisation; packaging; wires (electric); 15 mil; 25 mil; 40 GHz; ball-crescent bond type; bond wire lengths; equivalent circuit model; loop types; microwave bond wire interconnects; microwave packaging; modeling; optimization; repeatability investigation; ribbon bond interconnect topology; wedge bond type; wideband lumped-element model; Bonding; Circuit testing; Circuit topology; Electromagnetic modeling; Electromagnetic reflection; Equivalent circuits; Integrated circuit interconnections; Microwave frequencies; Wideband; Wire;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.982850

Filename

982850