• DocumentCode
    1560380
  • Title

    Testing and evaluating the quality-level of stratified multichip module instrumentation

  • Author

    Park, Nohpill ; Lombardi, Fabrizio ; Piuri, Vincenzo

  • Author_Institution
    Dept. of Comput. Sci., Oklahoma State Univ., Stillwater, OK, USA
  • Volume
    50
  • Issue
    6
  • fYear
    2001
  • fDate
    12/1/2001 12:00:00 AM
  • Firstpage
    1615
  • Lastpage
    1624
  • Abstract
    In this paper, approaches to measuring the quality-level of multichip module (MCM) instrumentations are proposed. The MCM is generally composed of a number of sets (or strata) of chips with different known-good-yields (KGYs), so-called stratified, since each stratum is procured from a separate manufacturer. This characteristic of MCM is employed to enhance the performance of the testing process thereby assuring the quality-level of MCMs. A stratified technique is proposed for testing MCMs. Its advantages are an improvement in quality-level and cost-effectiveness. The proposed testing approach is accomplished in the presence of uneven KGY for MCMs consisting of different sets (or strata) of chips. This approach referred to as the lowest yield-stratum first-testing (LYSFT) considers the unevenness of KGY between strata for testing the chips and improving the QL. For comparison purposes, exhaustive testing (ET), random testing (RT), and random stratified testing (RST) are also evaluated by using a Markov-chain model. Parametric results show that the LYSFT dramatically outperforms RT and RST for improving the quality-level. A considerable reduction in tests can be achieved by the LYSFT at a very small loss in quality-level compared with ET. Based on a proposed cost model, it is also shown that the LYSFT is the most cost-effective strategy. The validity of the proposed approach is further proved through Monte Carlo simulation
  • Keywords
    Markov processes; Monte Carlo methods; costing; instrumentation; integrated circuit testing; multichip modules; quality control; Markov-chain model; Monte Carlo simulation; cost model; cost-effectiveness improvement; defect-level; known-good-yields; lowest yield-stratum first-testing; multichip module instrumentation; quality-level measurement; stratified MCM instrumentation; testing process; Costs; Instruments; Manufacturing; Multichip modules; Packaging; Performance evaluation; Semiconductor device measurement; Testing; Very large scale integration; Wafer scale integration;
  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/19.982955
  • Filename
    982955