Title :
A global genetic algorithm based optimization technique for spiral inductor on silicon design
Author :
Wang, Tao ; Wang, Yong ; Chen, Kangsheng
Author_Institution :
Dept. of Inf. Sci. & Electron. Eng., Zhejiang Univ., Hangzhou, China
Abstract :
Spiral inductor on silicon, as the essential component of radio frequency integrated circuits, has attracted enormous academic and commercial interest. However, its quality factor is severely degraded by skin effect of metal traces and substrate coupling effect in radio frequency band, and a key problem when designing SIOS is to find optimal parameters to enhance the quality factor subject to some constraints. The optimization problem is formulated, which belongs to the class of nonlinear combinational optimization. Though some optimization algorithms have been proposed, they cannot perform global search to find more general parameters. This paper proposes a global optimization technique based on genetic algorithm, where all SIOS parameters are represented as chromosomes on which genetic operators are repeatedly applied to find better solutions. Experimental results show that genetic algorithm can effectively find out the optimal parameters to enhance the quality factor.
Keywords :
Q-factor; circuit optimisation; elemental semiconductors; genetic algorithms; inductors; integrated circuit design; radiofrequency integrated circuits; silicon; skin effect; Si; chromosomes; genetic operators; global genetic algorithm; global optimization technique; metal traces; nonlinear combinational optimization; optimal parameters; optimization algorithms; quality factor; radiofrequency band; radiofrequency integrated circuits; skin effect; spiral inductor on silicon design parameters; substrate coupling effect; Algorithm design and analysis; Degradation; Design optimization; Genetic algorithms; Inductors; Q factor; Radiofrequency integrated circuits; Silicon; Skin effect; Spirals;
Conference_Titel :
Intelligent Control and Automation, 2004. WCICA 2004. Fifth World Congress on
Print_ISBN :
0-7803-8273-0
DOI :
10.1109/WCICA.2004.1341954