• DocumentCode
    1560960
  • Title

    Hydrogen passivation of multicrystalline silicon

  • Author

    Dubé, Christopher E. ; Hanoka, Jack I.

  • Author_Institution
    Evergreen Solar, Inc., Marlborough, MA, USA
  • fYear
    2005
  • Firstpage
    883
  • Lastpage
    888
  • Abstract
    Hydrogen passivation using SiNx remains one of the most technologically significant developments of the solar cell industry. However, the nature of hydrogen diffusion through the bulk of the solar cell during high temperature processing and the details of how hydrogen passivates defects is a topic of ongoing investigation and debate. The model for diffusion of hydrogen in single-crystal silicon includes hydrogen trapping at impurities and vacancies and the existence of several charge states. In multicrystalline silicon the presence of dislocations and grain boundaries presents an even more complex situation for modeling the interaction between hydrogen and defects and impurities. In this review, hydrogen passivation of impurities and passivation of extended defects, such as dislocations and grain boundaries, are summarized, as well as diffusion of hydrogen through the solar cell bulk. Finally, implications for current understanding of hydrogen passivation of solar cells using industrial processing is discussed.
  • Keywords
    diffusion; dislocations; elemental semiconductors; extended defects; grain boundaries; hydrogen; impurities; passivation; reviews; silicon; solar cells; Si:H; SiN; charge states; dislocations; extended defects; grain boundaries; hydrogen diffusion; hydrogen passivation; hydrogen trapping; impurities; multicrystalline silicon; review; single-crystal silicon; solar cell bulk; solar cell industry; vacancies; Grain boundaries; Hydrogen; Impurities; Lattices; Passivation; Photovoltaic cells; Plasma density; Plasma properties; Silicon; Thin film transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE
  • ISSN
    0160-8371
  • Print_ISBN
    0-7803-8707-4
  • Type

    conf

  • DOI
    10.1109/PVSC.2005.1488273
  • Filename
    1488273