DocumentCode
1561164
Title
Foreword
Volume
1
fYear
2005
Abstract
Presents the welcome message from the conference proceedings.
Keywords
Asia; Components, Packaging, and Manufacturing Technology Society; Electronic packaging thermal management; Electronics packaging; Environmentally friendly manufacturing techniques; Integrated circuit packaging; Lead; Materials reliability; Organizing; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location
Singapore
Print_ISBN
0-7803-9578-6
Type
conf
DOI
10.1109/EPTC.2005.1614354
Filename
1614354
Link To Document