DocumentCode
1561310
Title
SOI pressure sensor
Author
French, P.J. ; Muro, H. ; Shinohara, T. ; Nojiri, H. ; Kaneko, H.
Author_Institution
Nissan Motor Co. Ltd., Yokosuka, Japan
fYear
1991
Firstpage
181
Lastpage
184
Abstract
The authors present a technique for fabricating single crystal silicon-on-oxide pressure sensors for high temperature applications. The SOI structure is formed from substrate material by etching techniques and thus good quality single crystal can be achieved without requiring lengthy or expensive processing. Islands of single crystal surrounded by oxide were fabricated. The islands are 7 mu m wide with a depth of 4.5 mu m. There are no pn junction isolations and the device can thus operate at higher temperatures. Longitudinal gauge factors of approximately 90 with a TCGF (temperature coefficient of gauge factor) of -0.22%/K were achieved for the lower doped samples. No leakage between resistors and the substrate could be detected for temperatures up to 300 degrees C.<>
Keywords
electric sensing devices; etching; high-temperature techniques; pressure transducers; semiconductor devices; semiconductor technology; semiconductor-insulator boundaries; 300 degC; 4.5 micron; 7 micron; SOI pressure sensor; Si; Si-SiO/sub 2/; etching; high temperature; longitudinal gauge factors; single crystal; temperature coefficient of gauge factor; Capacitive sensors; Crystallization; Etching; Oxidation; Piezoresistance; Resistors; Silicon; Substrates; Temperature sensors; Wafer bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location
San Francisco, CA, USA
Print_ISBN
0-87942-585-7
Type
conf
DOI
10.1109/SENSOR.1991.148832
Filename
148832
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