Title :
The analysis of the bending and twisting moments induced sweep deflection for semiconductor package applications
Author :
Kung, Huang-Kuang
Author_Institution :
Graduate Inst. of Mechatronic Eng., Cheng Shiu Univ., Kaohsiung
Abstract :
The main objectives of this research are to investigate the effects of bending moment and twisting moment on the sweep deflection model for different wire bond geometry. The bending and twisting geometry factors defined in the sweep deflection model intend to represent the effect of wire bond geometry on sweep deformation. The proposed model is proved to be very efficient and accurate in predicting the sweep deflection as compared with numerical results and experimental data
Keywords :
bending; lead bonding; semiconductor device packaging; bending moments; semiconductor package; sweep deflection; sweep deformation; twisting moments; wire bond geometry; Bonding forces; Drag; Electronics packaging; Equations; Geometry; Gold; Predictive models; Semiconductor device packaging; Solid modeling; Wire;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614377
