High frequency characteristics of low temperature processing and high density integrated capacitor on organic substrates

Author

Lok, B.K. ; Lu, Albert C W ; Fan, W. ; Tan, C.K. ; Goh, Gregory K L ; Chi, D.Z.

Author_Institution

Singapore Inst. of Manuf. Technol.

Volume

1

fYear

2005

Abstract

Rapidly growing performance and mixed-signal integration is driving the need for product and component miniaturization in electronics applications. Integral passive technology is a potentially attractive solution to replace discrete passives. Capacitors are widely used for broad ranging applications including filtering, tuning and power decoupling. This paper presents the performance characterization of two low temperature processes that are compatible with organic substrates. RF characterization up to 10 GHz was performed to extract the impedance profile, effective capacitance and capacitance density parameters

Keywords

dielectric materials; low-temperature techniques; substrates; thick film capacitors; thin film capacitors; capacitance density parameters; component miniaturization; effective capacitance; high frequency characteristics; impedance profile; integral passive technology; integrated capacitor; low temperature processing; organic substrates; Capacitance; Capacitors; Circuit topology; Data mining; Dielectric substrates; Frequency; Impedance; Polymers; Printing; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th

Conference_Location

Singapore

Print_ISBN

0-7803-9578-6

Type

conf

DOI

10.1109/EPTC.2005.1614414

Filename

1614414