Title :
Hot-wire chemical vapor deposition of silicon nitride for multicrystalline silicon solar cells
Author :
Goldbach, H.D. ; van der Werf, C.H.M. ; Loffler, J. ; Scarfo, A. ; Kylner, A.M.C. ; Stannowski, B. ; Arnoldbik, W.M. ; Weeber, A. ; Rieffe, H. ; Soppe, W.J. ; Rath, J.K. ; Schropp, R.E.I.
Author_Institution :
Debye Inst., Utrecht Univ., Netherlands
Abstract :
A new regime of high rate deposition of silicon nitride by hot wire chemical vapor deposition was investigated. The present design of the filament arrangement and the showerhead gas supply system allows for virtually unlimited scale-up. The deposition rates obtained were in excess of 5 nm/s. The refractive index (n at 2 eV; wavelength ∼630 nm) could be controlled from 1.90 ± 0.05 to 2.5 ± 0.05, by varying the SiH4 flow and the extinction coefficient (k) at 3.1 eV (wavelength 400 nm) was < 0.007 for all films of interest. The layers were tested on multicrystalline silicon solar cells in order to assess their passivation and antireflection properties. The cells had state-of-the-art values for all photovoltaic parameters, similar to cells with a microwave plasma deposited SiNx anti-reflection coating. An efficiency of 14.3% was reached using HWCVD-SiNx for multi-crystalline Si solar cells with an industrial process using screen printing.
Keywords :
CVD coatings; antireflection coatings; chemical vapour deposition; elemental semiconductors; extinction coefficients; passivation; refractive index; silicon; silicon compounds; solar cells; 14.3 percent; Si; SiNx; extinction coefficient; hot-wire chemical vapor deposition; microwave plasma deposited antireflection coating; multicrystalline silicon solar cells; passivation; photovoltaic parameters; refractive index; screen printing; silicon nitride; Chemical vapor deposition; Extinction coefficients; Optical films; Passivation; Photovoltaic cells; Photovoltaic systems; Refractive index; Silicon; Testing; Wire;
Conference_Titel :
Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE
Print_ISBN :
0-7803-8707-4
DOI :
10.1109/PVSC.2005.1488366