DocumentCode
1561817
Title
Analysis of silver thick-film contact formation on industrial silicon solar cells
Author
Grupp, Güpher ; Biro, Daniel ; Emanuel, Gernot ; Preu, Ralf ; Schitthelm, Frank ; Willeke, Gerhard
Author_Institution
Fraunhofer-Inst. fur Solare Energiesysteme, Freiburg, Germany
fYear
2005
Firstpage
1289
Lastpage
1292
Abstract
The silver thick-film contact is the most widely used front side contact for industrial silicon solar cells. The objective of the presented investigations was to improve the understanding of front side contact formation by varying the contact firing process. We therefore introduced an additional temperature plateau in the cooling zone. The firing process was assessed based on the results of the IV characteristic. Fill factor, series resistance and open circuit voltage were the main values taken into consideration. Additionally we earned out specific contact resistance and Corescan measurements. The performance of the solar cells was characterized by spectrally resolved internal quantum efficiency measurements and thermographic measurements. The results were correlated with the variations of the contact firing and are discussed referring to the different models of the current transport mechanism in thick-film contacts.
Keywords
contact resistance; elemental semiconductors; firing (materials); infrared imaging; silicon; silver; solar cells; thick film devices; Ag-Si; Corescan measurements; IV characteristic; contact firing process; contact resistance; cooling zone; current transport mechanism; fill factor; front side contact; industrial silicon solar cells; open circuit voltage; series resistance; silver thick-film contact formation; spectrally resolved internal quantum efficiency; thermographic measurements; Circuits; Contact resistance; Cooling; Electrical resistance measurement; Firing; Photovoltaic cells; Silicon; Silver; Temperature; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE
ISSN
0160-8371
Print_ISBN
0-7803-8707-4
Type
conf
DOI
10.1109/PVSC.2005.1488376
Filename
1488376
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