DocumentCode
1561849
Title
Simulation methodologies for electromagnetic compatibility (EMC) and signal integrity (SI) for system design
Author
Christopoulos, C. ; Thomas, D. WP ; Sewell, P. ; Paul, J. ; Biwojno, K. ; Wykes, J. ; Tang, Q. ; Greedy, S.
Author_Institution
George Green Inst. for Electromagn. Res., Nottingham Univ.
Volume
2
fYear
2005
Abstract
Current technology trends require the utilisation of very high clock rates which have a broad electromagnetic spectrum. Electronic equipment designers require accurate characterisation and optimisation of electrical components, sub-systems and complete systems at frequencies that extend well into the microwave spectrum. This paper aims to assess the state-of-the-art in full field solvers in system and sub-system design and in doing so identify the trends in simulation techniques that are targeted towards the development of complex designs which operate at high speeds. Particular emphasis is placed on the treatment of multiscale problems, the development of macronodes containing sub-wavelength features and optimal meshing techniques. Developments in these areas are illustrated with results typical of EMC and SI design issues
Keywords
electromagnetic compatibility; broad electromagnetic spectrum; electromagnetic compatibility; electronic equipment designers; macronodes; microwave spectrum; multiscale problems; optimal meshing; signal integrity; simulation techniques; sub-wavelength features; Circuits; Clocks; Design automation; Electromagnetic compatibility; Electromagnetic spectrum; Electronic equipment; Geometry; Microwave devices; Network topology; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location
Singapore
Print_ISBN
0-7803-9578-6
Type
conf
DOI
10.1109/EPTC.2005.1614438
Filename
1614438
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