• DocumentCode
    1561849
  • Title

    Simulation methodologies for electromagnetic compatibility (EMC) and signal integrity (SI) for system design

  • Author

    Christopoulos, C. ; Thomas, D. WP ; Sewell, P. ; Paul, J. ; Biwojno, K. ; Wykes, J. ; Tang, Q. ; Greedy, S.

  • Author_Institution
    George Green Inst. for Electromagn. Res., Nottingham Univ.
  • Volume
    2
  • fYear
    2005
  • Abstract
    Current technology trends require the utilisation of very high clock rates which have a broad electromagnetic spectrum. Electronic equipment designers require accurate characterisation and optimisation of electrical components, sub-systems and complete systems at frequencies that extend well into the microwave spectrum. This paper aims to assess the state-of-the-art in full field solvers in system and sub-system design and in doing so identify the trends in simulation techniques that are targeted towards the development of complex designs which operate at high speeds. Particular emphasis is placed on the treatment of multiscale problems, the development of macronodes containing sub-wavelength features and optimal meshing techniques. Developments in these areas are illustrated with results typical of EMC and SI design issues
  • Keywords
    electromagnetic compatibility; broad electromagnetic spectrum; electromagnetic compatibility; electronic equipment designers; macronodes; microwave spectrum; multiscale problems; optimal meshing; signal integrity; simulation techniques; sub-wavelength features; Circuits; Clocks; Design automation; Electromagnetic compatibility; Electromagnetic spectrum; Electronic equipment; Geometry; Microwave devices; Network topology; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
  • Conference_Location
    Singapore
  • Print_ISBN
    0-7803-9578-6
  • Type

    conf

  • DOI
    10.1109/EPTC.2005.1614438
  • Filename
    1614438