• DocumentCode
    1561860
  • Title

    Direct write contacts for solar cells

  • Author

    Kaydanova, Tanya ; Van Hest, Maikel F A M ; Miedaner, Alex ; Curtis, Calvin J. ; Alleman, Jeff L. ; Dabney, Matthew S. ; Garnett, Eric ; Shaheen, Sean ; Smith, Lee ; Collins, Reubin ; Hanoka, Jack I. ; Gabor, Andrew M. ; Ginley, David S.

  • Author_Institution
    Nat. Renewable Energy Lab., Golden, CO, USA
  • fYear
    2005
  • Firstpage
    1305
  • Lastpage
    1308
  • Abstract
    Ag, Cu and Ni metallizations were inkjet printed with near vacuum deposition quality. The approach developed can be easily extended to other conductors such as Pt, Pd, Au etc. Thick highly conducting lines of Ag and Cu demonstrating good adhesion to glass, Si and PCB have been printed at 100-200 °C in air and N2 respectively. Ag grids were inkjet-printed on Si solar cells and fired through the silicon nitride AR layer at 850 °C resulting in 8% cells. Next generation multicomponent inks (including etching agents) have also been developed with improved fire through contacts leading to higher cell efficiencies. PEDOT-PSS polymer based conductors were inkjet printed with conductivity as good or better than that of spin-coated films.
  • Keywords
    adhesion; antireflection coatings; conducting polymers; copper; elemental semiconductors; etching; firing (materials); nickel; printing; semiconductor device metallisation; silicon; silver; solar cells; vacuum deposition; 100 to 200 degC; 850 degC; Ag; Cu; Ni; PEDOT-PSS polymer based conductors; Si; SiNx; adhesion; direct write contacts; etching; inkjet printing; metallizations; silicon nitride AR layer; solar cells; spin-coated films; vacuum deposition; Adhesives; Conductive films; Conductors; Glass; Gold; Ink; Metallization; Photovoltaic cells; Polymer films; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE
  • ISSN
    0160-8371
  • Print_ISBN
    0-7803-8707-4
  • Type

    conf

  • DOI
    10.1109/PVSC.2005.1488380
  • Filename
    1488380