Title :
Impact of drop-in lead free solders on microelectronics packaging
Author :
Chew, Kai Hwa ; Pang, John H L
Author_Institution :
Singapore Asahi Chem. & Solder Ind. Pte Ltd
Abstract :
Lead-free solders and soldering technology will be a revisited concern in microelectronics packaging challenges to meet the demands of wafers-level packaging and 3D packaging operations where greater demands will be made on soldering smaller pads sizes and the high expectations of solder joint strength and long-term reliability. This paper reports on the drop-in lead-free solder approach and will provide characterization research results on Sn-Ag-Cu-In drop-in solder material composition, wetting and assembly characteristics and mechanics properties for stress-strain and creep performance compared to Sn3.8Ag0.7Cu solder
Keywords :
copper alloys; impact (mechanical); indium alloys; integrated circuit packaging; integrated circuit reliability; silver alloys; solders; tin alloys; Sn-Ag-Cu-In; assembly characteristics; creep performance; drop-in lead free solders; lead-free solders; long-term reliability; microelectronics packaging; solder joint strength; soldering technology; stress-strain performance; wafer-level packaging; wetting characteristics; Creep; Environmentally friendly manufacturing techniques; Fatigue; Lead; Microelectronics; Packaging; Soldering; Surface-mount technology; Temperature; Tin alloys;
Conference_Titel :
Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
Conference_Location :
Singapore
Print_ISBN :
0-7803-9578-6
DOI :
10.1109/EPTC.2005.1614446
