Title :
Inductive interconnect width optimization for low power
Author :
El-Moursy, Magdy A. ; Friedman, Eby G.
Author_Institution :
Dept. of Electr. & Comput. Eng., Rochester Univ., NY, USA
Abstract :
The width of an interconnect line affects the total power consumed by a circuit. A tradeoff exists, however, between the dynamic power and the short-circuit power in determining the width of inductive interconnects. The optimum line width that minimizes the total transient power dissipation is determined in this paper. A closed form solution for the optimum width with an error of less than 6% is presented. For a specific set of line parameters and resistivities, the power is reduced by almost 80% as compared to a minimum wire width. Considering the driver size in the design process, the optimum wire and driver size that minimizes the total transient power is also determined.
Keywords :
circuit optimisation; circuit simulation; driver circuits; integrated circuit design; integrated circuit interconnections; integrated circuit modelling; low-power electronics; dynamic power/short-circuit power tradeoff; inductive interconnect line width optimization; line driver size; line resistivity; low power interconnect; power reduction; total transient power dissipation; Capacitance; Driver circuits; Impedance; Integrated circuit interconnections; Inverters; Power dissipation; Power transmission lines; Propagation losses; Semiconductor device modeling; Wire;
Conference_Titel :
Circuits and Systems, 2003. ISCAS '03. Proceedings of the 2003 International Symposium on
Print_ISBN :
0-7803-7761-3
DOI :
10.1109/ISCAS.2003.1206252
