• DocumentCode
    1561977
  • Title

    Prototype development for chip-chip interconnection by multimode waveguide

  • Author

    Pong, Bryan Lee Sik ; Pamidigantham, R. ; Premachandran, C.S.

  • Author_Institution
    A*Star Inst. of Microelectron., Singapore
  • Volume
    2
  • fYear
    2005
  • Abstract
    A low cost multimode polymer waveguide has been developed for chip to chip communications application. Due to the application is design for short distance communications, 850 nm wavelength is chosen in this case. We have chosen SU 8 as the core waveguide due to its highly transparent in 850 nm range with high thermal stabilities of >200 degree C and low moisture intakes. A propagation loss of less than 1 dB/cm at 850 nm has been achieved by using a cut back method. Optical measurements found that no change in the propogation loss after going through standard reflow temperature profile used for printed circuit board (PCB)
  • Keywords
    optical interconnections; optical polymers; optical waveguides; printed circuits; 850 nm; chip to chip communications; chip-chip interconnection; core waveguide; cut back method; moisture intakes; multimode polymer waveguide; optical measurements; printed circuit board; propogation loss; short distance communications; standard reflow temperature profile; thermal stability; Costs; Integrated circuit interconnections; Loss measurement; Moisture; Optical losses; Optical waveguides; Polymers; Propagation losses; Prototypes; Thermal stability;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th
  • Conference_Location
    Singapore
  • Print_ISBN
    0-7803-9578-6
  • Type

    conf

  • DOI
    10.1109/EPTC.2005.1614453
  • Filename
    1614453