Thermal modelling of multiple die packages

Various aspects of the dynamic thermal modelling of multiple die packages are discussed in the paper. After a short literature review of the subject the structure function based thermal modelling is presented briefly with an example that was measured in a package, containing stacked dies. The second part of the paper present the new concept of multiport modelling of multiple die packages, where each port is assigned to a die in the package. We demonstrate with experimental results, that the proposed frequency dependent Z_th thermal impedance matrix representation of the multiple die packages provides a very informative characterisation of the dynamic thermal behaviour of these packages