Thermal analysis and experimental validation on TFT-LCD panels for image quality concerns

Author

Chu, Chung-Yi ; Pan, Min-Chun ; Ho, Johnson

Author_Institution

Dept. of Mech. Eng., National Central Univ.

Volume

2

fYear

2005

Abstract

The heat source from cold cathode fluorescent lamps (CCFLs) in the backlight module of a TFT-LCD TV causes the cell assembly to warpage. The extruding phenomenon, appearing between the cell and its bezel, leads to defects in display of the TFT-LCD TV. The study successfully simulates and predicts the process by finite element analysis (FEA), computational fluid dynamics (CFD), and structure-heat transfer. The paper also shows the efficient experimental verification which uses kinds of physical sensors to measure the temperature variation and thermal stresses on the surface of LCD-TV cell. The achievements and techniques can be employed to analyze and design the geometric parameters of different components in LCD-TV modules for product optimization

Keywords

computational fluid dynamics; finite element analysis; flat panel displays; heat transfer; liquid crystal displays; television picture tubes; temperature measurement; temperature sensors; thermal analysis; thermal stresses; thin film transistors; CCFL; CFD; FEA; LCD-TV cell; LCD-TV modules; TFT-LCD TV; TFT-LCD panels; backlight module; cell assembly; cold cathode fluorescent lamps; computational fluid dynamics; finite element analysis; heat source; image quality; structure-heat transfer; thermal analysis; thermal stresses; Assembly; Cathodes; Computational fluid dynamics; Fluorescent lamps; Image analysis; Image quality; TV; Temperature measurement; Temperature sensors; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology Conference, 2005. EPTC 2005. Proceedings of 7th

Conference_Location

Singapore

Print_ISBN

0-7803-9578-6

Type

conf

DOI

10.1109/EPTC.2005.1614463

Filename

1614463